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TG-30 Thermal Compound

$19

TG-30 is a premium thermal compound for high standard cooling performance designed to lower CPU temperatures effectively.

In stock

SKU: CL-O023-GROSGM-A Category:

Product Description

High Thermal Conductivity
The thermal compound contains diamond powder that improves thermal conductivity to maximize heat transfer.
Easy to Apply
The honeycomb stencil creates an easier way to apply your thermal compound for a neat and well-covered surface which fits all CPUs.
All-In-One Application Kit
This thermal compound application kit includes a set of easily-applied tools for immediate use.
Lasts for Longer
The high quality thermal compound provides a longer lifespan eliminating dry-out or cracking while in use.

Additional Information

Weight 0.02 kg
Dimensions 17.9 x 8.5 x 1.5 cm